MediaTek has unveiled the Dimensity 9500, its new flagship mobile platform built to deliver on-device AI, console-class gaming, and improved power efficiency. The company says smartphones powered by the chip will arrive in the fourth quarter of 2025.
The Dimensity 9500 introduces a third-generation “All Big Core” CPU, pairing a 4.21GHz ultra core with three premium cores and four performance cores. MediaTek claims the CPU offers up to 32% higher single-core and 17% higher multi-core performance compared with its predecessor, while the ultra core uses up to 55% less power at peak. A second-generation Dimensity Scheduling Engine aims to maintain smooth responsiveness and energy efficiency under heavy workloads, including gaming and social audio.
AI capabilities form the centerpiece of the Dimensity 9500. The platform combines a new compute-in-memory “Super Efficient NPU” with the ninth-generation NPU 990 and Generative AI Engine 2.0. MediaTek says this setup doubles AI compute while reducing peak power by 56% during intensive inference tasks. The chip can handle 3B-parameter LLMs at up to 100% faster output, process BitNet 1.58‑bit models, and manage 128K-token long-context tasks. This positions the Dimensity 9500 as a platform for on-device AI assistants, generative content creation, and multimodal workloads without cloud dependency.
Graphics performance also receives a boost with the Arm Mali-G1 Ultra GPU, which supports 120FPS ray tracing, frame interpolation, and Unreal Engine integrations including MegaLights in UE 5.6 and Nanite in UE 5.5. MediaTek claims a 33% increase in peak GPU performance and 42% better power efficiency. System cache and SLC improvements ensure that CPU, GPU, and NPU pipelines remain fed during gaming.
Imaging and display are handled by the Imagiq 1190 ISP and MiraVision Adaptive Display. The ISP supports up to 200MP capture, RAW-domain preprocessing, 30fps continuous focus tracking, and cinematic 4K 60fps portrait video. MiraVision tunes contrast and color based on ambient light and panel characteristics for better outdoor clarity and indoor eye comfort.
Connectivity features include AI-driven power optimization, up to 10% lower 5G power, 20% lower Wi-Fi power, 5CC carrier aggregation for 15% higher bandwidth, and AI congestion prediction to cut network latency by half.
Smartphones with the Dimensity 9500 are expected to debut in Q4 2025, targeting users seeking advanced AI experiences, high-end gaming, and efficient performance in a single platform.
Key Area | Dimensity 9500 |
---|---|
Process | TSMC 3nm (N3P class, vendor 3nm) |
CPU | 1× C1-Ultra up to 4.21GHz, 3× C1-Premium, 4× C1-Pro; third-gen All Big Core |
CPU Performance | Up to 32% higher single-core, 17% higher multi-core vs previous gen |
CPU Power | Ultra core up to 55% lower peak power; 30% better efficiency in multitasking |
GPU | Arm Mali-G1 Ultra; up to 33% higher peak performance, 42% better power efficiency; 120FPS ray tracing |
AI / NPU | MediaTek NPU 990; Generative AI Engine 2.0; compute-in-memory Super Efficient NPU; BitNet 1.58-bit |
AI Performance | 2× AI compute; 100% faster 3B-parameter LLM output; 128K tokens; up to 56% lower peak power |
Memory | LPDDR5X (up to 10.7Gbps) |
Storage | Industry-first 4-channel UFS 4.1; 2× read/write speeds; 40% faster model loading |
Imaging | Imagiq 1190; RAW pre-processing; up to 200MP capture; 30fps continuous focus; 4K 60FPS portrait video |
Display | MiraVision Adaptive Display; WQHD+ up to 180Hz support |
Connectivity | 5G with 5CC carrier aggregation (+15% bandwidth), Wi-Fi 7, Bluetooth enhancements; AI power and latency optimizations |
Power Savings | Up to 10% lower 5G power, 20% lower Wi-Fi power; 50% lower network latency via AI |
Availability | First flagships in Q4 2025 |
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